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Fiber Optics
XPAK 1310 nm Module 10 Gigabit Pluggable Transceiver Compatible with XPAK MSA Rev. 2.3
Preliminary Data Sheet Features Standards * Compatible with IEEE Std 802.3aeTM-2002 * Compatible with Fibre Channel 10GFC Draft 3.5 * Compatible with XPAK MSA Rev. 2.3 Optical
V23833-G2104-A001 V23833-G6104-A001 V23833-G6104-A011
File: 2104
* IEEE Ethernet: Serial 1310 nm 10GBASE-LR * T11 Fibre Channel: Serial 1310 nm 1200-SM-LL-L * 10 Gigabit Fibre Channel: 10.51875 Gbit/s (V23833-G2104-A001) * 10 Gigabit Ethernet: 10.3125 Gbit/s (V23833-G6104-A0x1) * Transmission distance up to 10 km1) * Uncooled directly modulated Distributed Feedback (DFB) laser at 1310 nm * SC connector, single mode fiber * Full duplex transmission mode * Eye safety class 1 (IEC 60825-1:A2)
File: 2118
1)
Maximum reach as defined by IEEE. Longer reach possible depending upon link implementation.
Part Number
Standard
De-Latch Mechanism Bail None
1
Connector SC SC SC
Laser Class 1 1 1
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V23833-G2104-A001 Fibre Channel Bail V23833-G6104-A001 Ethernet V23833-G6104-A011 Ethernet
Preliminary Product Information
V23833-Gx104-A0x1
Applications * DOM - Loss Of Signal from receiver - Laser safety alarm (with reset function) - Supply voltage monitor (+3.3 V, Adaptable Power Supply) - Transmit power - Module temperature - Received power - Transmit bias current monitor Mechanical * Mezzanine profile: 2.68" L x 1.42" W x 0.38" H (68.07 mm x 35.99 mm x 9.8 mm) * Mezzanine module height for PCI card applications and mid-board mounting * Separated signal/chassis ground (a common signal/chassis ground module version is available upon request) * Belly-to-belly applications * De-latch mechanism with low extraction force (V23833-Gxxxx-Ax0x only) * Built-in heat sink Electrical * * * * Hot pluggable Power supply: +5.0 V, +3.3 V, Adaptable Power Supply (APS: +1.8 V) Total power consumption: 3.3 W typical XAUI electrical interface - 3.125 Gbit/s Ethernet (V23833-G61xx-xxxx) - 3.1875 Gbit/s Fibre Channel (V23833-G21xx-xxxx) * Management and control via MDIO 2-wire bus * 70-pin connector Applications * * * * * * * * * * 10 Gbit/s Ethernet and Fibre Channel transmission systems for Long Range (LR) Integration on PCI card Mid-board mounting Belly-to-belly for high density applications Enterprise and campus network applications Storage applications Backplane and switch applications Core and edge routers Aggregation point for lower date rate XPAK evaluation kit V23833-G9909-Z001 available upon request
Preliminary Product Information
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V23833-Gx104-A0x1
Pin Configuration Pin Configuration
70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 GND GND RESERVED RESERVED GND TX LANE3- TX LANE3+ GND TX LANE2- TX LANE2+ GND TX LANE1- TX LANE1+ GND TX LANE0- TX LANE0+ GND GND GND RX LANE3- RX LANE3+ GND RX LANE2- RX LANE2+ GND RX LANE1- RX LANE1+ GND RX LANE0- RX LANE0+ GND RESERVED RESERVED GND GND
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35
GND GND GND 5.0 V 3.3 V 3.3 V APS APS LASI RESET VEND SPECIFIC TX ON/OFF RESERVED MOD DETECT VEND SPECIFIC VEND SPECIFIC MDIO MDC PRTAD4 PRTAD3 PRTAD2 PRTAD1 PRTAD0 VEND SPECIFIC APS SET RESERVED APS SENSE APS APS 3.3 V 3.3 V 5.0 V GND GND GND
Toward Bezel
54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36
Top of Transceiver PCB
Bottom of Transceiver PCB (as viewed through top)
File: 2301
Figure 1
XPAK Transceiver Electrical Pad Layout
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Preliminary Product Information
V23833-Gx104-A0x1
Pin Configuration Connector Pin Assignments Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Signal Name GND GND GND +5.0 V DC Power +3.3 V DC Power +3.3 V DC Power APS APS LASI RESET Vendor Specific TX ON/OFF Reserved MOD DETECT Vendor Specific Vendor Specific MDIO MDC PRTAD4 PRTAD3 PRTAD2 PRTAD1 PRTAD0 Vendor Specific APS SET Reserved APS SENSE APS APS +3.3 V DC Power +3.3 V DC Power +5.0 V DC Power GND GND GND
4
Pin No. 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36
Signal Name GND GND Reserved Reserved GND TX LANE3- TX LANE3+ GND TX LANE2- TX LANE2+ GND TX LANE1- TX LANE1+ GND TX LANE0- TX LANE0+ GND GND GND RX LANE3- RX LANE3+ GND RX LANE2- RX LANE2+ GND RX LANE1- RX LANE1+ GND RX LANE0- RX LANE0+ GND Reserved Reserved GND GND
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Preliminary Product Information
V23833-Gx104-A0x1
Pin Configuration Pin Description Signal Name Level I/O Pin No. Management and Monitoring Ports MDIO Open Drain I/O 17 Description Management Data I/O. Requires external 10 - 22 k pull-up to 1.8 V on host. Management Data Clock Input Port Address Input bit 4 Port Address Input bit 3 Port Address Input bit 2 Port Address Input bit 1 Port Address Input bit 0 Link Alarm Status Interrupt Output. Open Drain Compatible Output with 10 - 20 k pull-up on host. Logic high = Normal Operation Logic low = Status Flag Triggered Reset Input. Open Drain Compatible Input with 10 k pull-up to APS internal to transceiver. Logic high = Normal Operation Logic low = RESET Note: 1.8 V is APS Vendor Specific Pins. Leave unconnected when not used. TX ON/OFF Input. Open Drain Compatible Input with 10 k pull-up to APS internal to transceiver. Logic high = Transmitter On Logic low = Transmitter Off Note: 1.8 V is APS Pulled low inside transceiver through a 1 k resistor to Ground
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MDC PRTAD4 PRTAD3 PRTAD2 PRTAD1 PRTAD0 LASI
1.2 V CMOS 1.2 V CMOS 1.2 V CMOS 1.2 V CMOS 1.2 V CMOS 1.2 V CMOS Open Drain
I I I I I I O
18 19 20 21 22 23 9
RESET
Open Drain
I
10
Vendor Specific TX ON/OFF
11,15,16,24 Open Drain I 12
MOD DETECT
Preliminary Product Information
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14
5
V23833-Gx104-A0x1
Pin Configuration Pin Description (cont'd) Signal Name Level Transmit Functions Reserved Reserved TX LANE 3- AC-coupled, TX LANE 3+ Internally TX LANE 2- biased TX LANE 2+ differential TX LANE 1- XAUI TX LANE 1+ TX LANE 0- TX LANE 0+ Receive Functions Reserved Reserved RX LANE 0+ AC-coupled, RX LANE 0- Internally RX LANE 1+ biased RX LANE 1- differential RX LANE 2+ XAUI RX LANE 2- RX LANE 3+ RX LANE 3- I/O I I I I I I I I I I O O O O O O O O O O Pin No. 68 67 65 64 62 61 59 58 56 55 38 39 41 42 44 45 47 48 50 51 Description Reserved For Future Use Reserved For Future Use Module XAUI Input Lane 3- Module XAUI Input Lane 3+ Module XAUI Input Lane 2- Module XAUI Input Lane 2+ Module XAUI Input Lane 1- Module XAUI Input Lane 1+ Module XAUI Input Lane 0- Module XAUI Input Lane 0+ Reserved For Future Use Reserved For Future Use Module XAUI Output Lane 0+ Module XAUI Output Lane 0- Module XAUI Output Lane 1+ Module XAUI Output Lane 1- Module XAUI Output Lane 2+ Module XAUI Output Lane 2- Module XAUI Output Lane 3+ Module XAUI Output Lane 3-
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V23833-Gx104-A0x1
Pin Configuration Pin Description (cont'd) Signal Name Level DC Power GND 0 V DC I/O I Pin No. 1,2,3,33,34, 35,36,37,40, 43,46,49,52, 53,54,57,60, 63,66,69,70 7,8,28,29 27 25 Description Ground connection for signal ground on the module
APS +1.8 V APS SENSE +1.8 V APS SET GND
I O I
3.3 V 5.0 V Reserved Reserved
+3.3 V DC +5.0 V DC
I I
5,6,30,31 4,32 26 13
Input from Adaptive Power Supply APS Sense Output. Connected to the APS input inside transceiver. Feedback input from APS. Connected to GND through a zero resistor inside the transceiver. DC Power Input, +3.3 V DC, Nominal DC Power Input, +5.0 V DC, Nominal Reserved for APD. Do not connect. Reserved. Do not connect.
Preliminary Product Information
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V23833-Gx104-A0x1
Description Description System Block Diagram (10 Gbit/s Ethernet)
Vcc
Hot Swap Control MDIO
Management Data Interface
MDC
Data Management
BIST
10GbE MAC + RS
8B/10B XGXS
XAUI
8B/10B XGXS
4x 3.125 Gbit/s SerDes
64B/66B
Encoder/ Decoder
4x 4x 3.125 Gbit/s 3.125 Gbit/s SerDes
10 Gbit/s SerDes & CDR +CMU
Laser Laser Driver
DFB Laser 10 Gbit/s Optical (Single Mode Fiber)
LA
PIN TIA
70-pin Edge Connector
File: 2302
Figure 2 Optical Interface Standard Specifications * IEEE Std 802.3aeTM-2002 clause 52, 10GBASE-LR * Fibre Channel 10GFC Draft 3.5, 1200-SM-LL-L * XPAK MSA 2.3
Fiber Type B1.1 SMF B1.3 SMF
1)
Differential Group Delay Maximum (ps) 10 10
Operating Range (meters)1) 2 to 10,000 2 to 10,000
Operating range as defined by IEEE and Fibre Channel standards. Longer reach possible depending upon link implementation.
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V23833-Gx104-A0x1
Description Electrical Interface Standard Specifications * IEEE Std 802.3aeTM-2002 clause 45 & 47 * XPAK MSA 2.3 Environment: Thermal Management Recommendations Operating air inlet temperature: Operating Airflow: Operating Humidity: 0C - 50C 3 m/s maximum defined per XPAK MSA 0% - 95% RH non-condensing
Module can withstand and operate with case temperature of 75C for up to 96 hrs/yr. Transceiver requires airflow across cooling fins. Maximum airflow required per XPAK MSA is 3 m/s. Actual airflow required to provide adequate cooling for module is 1 m/s with a maximum air inlet temperature of 50C. A maximum case temperature of 70C must be observed. Fibers and Connectors The transceiver has SC receptacles for both Tx and Rx. The transceiver is designed for single mode SC cables, 0 polished endface (PC). 70-pin Connector The module interface connector is a 70-pin, printed circuit board edge connection with a 0.5 mm pitch. The appropriate mating connector for the customer PCB is a 70-pin SMT, dual row, right angled, edge connector, 0.5 mm pitch (TycoAmp part number 1367337-1, Molex part number 74441-0003 or equivalent). Cage Requirement The cage assembly required to mount the XPAK module is defined by the MSA. There are two cage designs for the module, tall and mezzanine profile. For correct operation and EMI design the correct cage size must be selected for the appropriate module. Alternatively a flangeless cage design is specified where there is limited size. A sufficient EMI gasket that connects from the cage to the face plate must be fitted. The mechanical design must ensure that no air gaps exist between the cage and the face plate while the module is plugged in. Recommended XPAK rail assembly, Molex part number 74732-0200.
Preliminary Product Information
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V23833-Gx104-A0x1
Description DOM Parameters Parameter min. Transceiver Temperature Monitor Accuracy1) Transmit Bias Current Monitor Accuracy2) Transmit Power Monitor Accuracy Receive Power Monitor Accuracy
1) 2) 3)
Values typ. max. 5 10 3 3
Unit C % dB dB
3)
3)
0 to 70C case temperature. 0 to 12.5 mA. 0 to 6.5 mW.
Regulatory Compliance Feature ESD: Electrostatic Discharge to the Electrical Pins (HBM) Immunity: Against Electrostatic Discharge (ESD) to the Module Receptacle Immunity: Against Radio Frequency Electromagnetic Field Emission: Electromagnetic Interference (EMI) Standard EIA/JESD22-A114-B (MIL-STD 883D Method 3015.7) EN 61000-4-2 IEC 61000-4-2 Comments Class 1a (> 500 V)
Discharges ranging from 2 kV to 15 kV to the front end / faceplate / receptacle cause no damage to module (under recommended conditions). With a field strength of 10 V/m, noise frequency ranges from 10 MHz to 2 GHz. No effect on module performance between the specification limits. Noise frequency range: 30 MHz to 40 GHz Radiated emission does not exceed specified limits when measured inside a shielding enclosure with MSA conform cutout.
EN 61000-4-3 IEC 61000-4-3
FCC 47 CFR Part 15, Class B EN 55022 Class B CISPR 22
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V23833-Gx104-A0x1
Technical Data Technical Data Absolute Maximum Ratings Parameter Storage Ambient Temperature
1) 1)
Symbol
Limit Values min. max. 85 65 80 6 4 2 500 1.5 -20 0 0 0 0 0
Unit C C C V V V V dBm
Operating Ambient Temperature Operating Case Temperature1) Supply Voltage +5.0 V Supply Voltage +3.3 V Supply Voltage APS
TAs TAo TCo V5 V3 Vaps
STd RxP max
Static Discharge Voltage, All Pins Average Receive Optical Power
1)
Non condensing.
Exceeding any one of these values may permanently destroy the device. Recommended Operating Conditions Parameter Operating Case Temperature1) Transceiver Total Power Consumption Supply Voltage +5.0 V Supply Current +5.0 V Supply Voltage +3.3 V Supply Current +3.3 V Supply Voltage APS Supply Current APS
1)
Symbol min.
Values typ. 3.3 4.75 3.14 1.746 5.0 50 3.3 550 1.8 700 1.854 3.47 max. 70 3.5 5.25 0
Unit C W V mA V mA V mA
TC P VCC5 ICC5 VCC3 ICC3 VCC aps ICC aps
Worst case thermal location, see Figure 12. See also Environment: Thermal Management Recommendations.
Preliminary Product Information
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V23833-Gx104-A0x1
Technical Data Optical Characteristics
(VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, VCC aps = 1.746 V to 1.854 V, TC = 0C to 70C)
Parameter Transmitter Launch Power in OMA minus TDP Average Launch Power Center Wavelength Range Spectral Width (-20 dB) Side Mode Suppression Ratio Extinction Ratio Relative Intensity Noise12OMA Optical Modulation Amplitude (OMA) Transmitter and Dispersion Penalty Average Launch Power of OFF Transmitter Optical Return Loss Tolerance Transmitter Reflectance Eye Mask Definition Receiver Stressed Receiver Sensitivity Sensitivity in OMA1) Average Receive Power Loss Of Signal Assert Level Loss Of Signal Hysteresis Receiver Reflectance Center Wavelength Range Electrical 3 dB Upper Cut-off Frequency
1)
Symbol min.
Values typ. max.
Unit
PO-OMA PO-Avg
C-Tx I SMSR ER RIN OMA TDP
-6.2 -8.2 1290 30 3.5 -5.2 3.2 -30 12 -12 According to IEEE and Fibre Channel 5 -128 -1 1310 0.5 0.5 1330 0.6
dBm dBm nm nm dB dB dB/Hz dBm dB dBm dB dB
PO-OFF
ORLT REFTx
PIN-S PIN PIN-max PLOSa PLOSh
REFRx C-Rx 3dBCO
-10.3 -12.6 0.5 -17 1 1260 2 -13 4 -12 1355 12.3
dBm dBm dBm dBm dB dB nm GHz
Receiver sensitivity, which is defined for an ideal input signal is informative only.
Preliminary Product Information
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V23833-Gx104-A0x1
Technical Data Electrical DC Characteristics
(VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, VCC aps = 1.746 V to 1.854 V, TC = 0C to 70C)
Parameter
Symbol min.
1)
Values typ. max.
Unit
1.2 V CMOS (1.8 V CMOS Compatible ) I/O DC Characteristics (PRTAD; LASI; RESET; TX_ONOFF) External Pull-up Resistor for Open Drain Output High Voltage2) Output Low Voltage2) Input High Voltage Input Low Voltage Input Pull-down Current3) XAUI I/O DC Characteristics (TXLANE[0..3]; RXLANE[0..3]) Differential Input Amplitude (pk-pk)4) Differential Output Amplitude (pk-pk)4) MDIO I/O DC Characteristics (MDIO; MDC) Output Low Voltage5) Output Low Current Input High Voltage Input Low Voltage Pull-up Supply Voltage Input Capacitance Load Capacitance External Pull-up Resistance
1) 2) 3) 4) 5)
Rpullup Voh Vol Vih Vil Ipd
10 1
22
k V
0.15 0.84 20 1.854 0.36 120
V V V A
Vin_xaui Vout_xaui
200 800
2500 1600
mV mV
VOL IOL VIH VIL VPU CIN CLOAD RLOAD
-0.3 0.84 -0.3 1.746 1.8
0.2 4 1.854 0.36 1.854 10 470
V mA V V V pF pF
200
For 1.8 V CMOS Voh = 1.65 V min., Vol = 0.15 V max., Vih = 1.17 V min., Vil = 0.63 V max. Rpull-up = 10 k to 1.8 V. Vin = 1.8 V. AC coupled. IOL = 100 A.
Preliminary Product Information
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V23833-Gx104-A0x1
Technical Data Electrical AC CharacteristicsCharacteristics
(VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, VCC aps = 1.746 V to 1.854 V, TC = 0C to 70C)
Parameter
Symbol min.
Values typ. max.
Unit
XAUI Input AC Characteristics (TXLANE[0..3]) Baud Rate RXAUIIN Fibre Channel Ethernet Baud Rate Tolerance Differential Input Impedance Differential Return Loss1) Input Differential Skew2) RTOLXAUI -100 80 10
Gbit/s 3.1875 3.125 100 100 120 75 ppm dB ps
ZINXAUI
|S11|
tSKEWIN
Jitter Amplitude Tolerance3) JXAUITOL XAUI Output AC Characteristics (RXLANE[0..3]) Baud Rate RXAUIOUT Fibre Channel Ethernet Baud Rate Variation Rise and Fall Times 20% - 80% Output Differential Skew Output Differential Impedance Total Jitter4) RXAUIVAR -100 40
Gbit/s 3.1875 3.125 100 100 15 80 10 0.35 100 120 ppm ps ps dB UI
tr, tf tSKEWOUT ZOUTXAUI
TJXAUI
Differential Output Return Loss1) |S22|
Deterministic Jitter4) DJXAUI 0.17 UI Power-On Reset AC Characteristics Power-On Reset and According to XENPAK MSA Issue 3.0 Draft 4.0, TX_ONOFF Characteristics 2002-9-9
Preliminary Product Information
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V23833-Gx104-A0x1
Technical Data Electrical AC CharacteristicsCharacteristics (cont'd)
(VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, VCC aps = 1.746 V to 1.854 V, TC = 0C to 70C)
Parameter MDIO I/O AC Characteristics (MDIO; MDC) MDIO Data Hold Time
Symbol min.
Values typ. max.
Unit
tHOLD MDIO Data Setup Time tSU Delay from MDC Rising Edge to tDELAY
MDIO Data Change
10 10 300 2.5
ns ns ns MHz
MDC Clock Rate
1) 2) 3) 4)
fMAX
100 MHz to 2.5 GHz. At crossing point. Per IEEE Std 802.3ea. At near-end. No pre-equalization. 1 UI = 320 ps.
Mechanical Characteristics Parameter Module Retention Force (latch strength) Module Insertion Force Module Extraction Force (with kick-out) Module Extraction Force (without kick-out) 0-80 UNF Screw Torque1)
1)
Symbol min. FRET FIN FEXT-K FEXT
Values typ. 200 40 16 25 10 max.
Unit N N N N cNm
0-80 UNF
Two 0-80 UNF screws are used to secure the XPAK module (no bail de-latch version V23833-Gxxxx-Ax1x) in the cage. The XPAK module is supplied with the screws assembled, and removal is required prior to insertion into the cage.
Preliminary Product Information
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V23833-Gx104-A0x1
Eye Safety Eye Safety This laser based single mode transceiver is a Class 1 product. It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and 1040.11 except for deviations pursuant to Laser Notice 50, dated July 26, 2001. CLASS 1 LASER PRODUCT To meet laser safety requirements the transceiver shall be operated within the Absolute Maximum Ratings. Attention: All adjustments have been made at the factory prior to shipment of the devices. No maintenance or alteration to the device is required. Tampering with or modifying the performance of the device will result in voided product warranty. Note: Failure to adhere to the above restrictions could result in a modification that is considered an act of "manufacturing", and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (ref. 21 CFR 1040.10 (i)). Laser Data Wavelength Accessible Emission Limit (as defined by IEC: 7 mm aperture at 14 mm distance) Beam divergence (full angle) 1310 nm 15.6 mW 11
FDA
Complies with 21 CFR 1040.10 and 1040.11
IEC
Class 1 Laser Product
File: 2411
Figure 3
Required Labels
Laser Emission
Tx
Top view
Rx
File: 2308
Figure 4
Laser Emission
Preliminary Product Information
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V23833-Gx104-A0x1
Application Notes Application Notes NVRAM Register Contents Address Dec Hex 32775 8007 32776 8008 32777 8009 32778 800A 32779 800B 32780 800C 32781 800D 32782 800E 32783 800F 32784 8010 32785 8011 32786 8012 32787 8013 32788 8014 32789 8015 32790 8016 32791 8017 32792 8018 32793 8019 32794 801A 32795 801B 32796 801C 32797 801D 32798 801E 32799 801F 32800 8020 32801 8021 32802 8022 32803 8023 Range Basic Group Dec Hex Header XENPAK MSA version supported 30 1E NVR size in bytes Number of bytes used Basic field address Customer field address Vendor field address Extended vendor field address Reserved Transceived type Connector Encoding Bit rate Protocol Standards compliance codes 1 0 0 181 11 119 167 0 0 0 4 1 1 40 73 1 2 0 0 0 0 0 0 0 0 0 3 232 1 0 0 B5 B 77 A7 0 0 0 4 1 1 28 49 1 2 0 0 0 0 0 0 0 0 0 3 E8 XENPAK MSA 3.0 Definition Value Comment Rev. 3.0 256 181 B 77 A7 0 0 0 XPAK SC NRZ 10313 10GBE LR not used not used not used not used not used not used not used not used not used 10 km
Preliminary Product Information
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Application Notes NVRAM Register Contents (cont'd) Address Dec Hex 32804 8024 32805 8025 32806 8026 32807 8027 32808 8028 32809 8029 32810 802A 32811 802B 32812 802C 32813 802D 32814 802E 32815 802F 32816 8030 32817 8031 32818 8032 32819 8033 32820 8034 32821 8035 32822 8036 32823 8037 32824 8038 32825 8039 32826 803A 32827 803B 32828 803C 32829 803D 32830 803E 32831 803F 32832 8040 32833 8041 Vendor name Vendor OUI Wavelength channel 3 Wavelength channel 1 Group Basic XENPAK MSA 3.0 Definition Fiber type Wavelength channel 0 Value Dec Hex 32 20 0 1 255 184 0 0 0 0 0 0 0 0 0 1 67 76 32 3 34 96 0 73 78 70 73 78 69 79 78 0 1 FF B8 0 0 0 0 0 0 0 0 0 1 43 4C 20 3 22 60 0 49 4E 46 49 4E 45 4F 4E I N F I N E O N 00-13-19 not used not used not used not used not used not used not used not used not used 00-0A-CB Comment SM 1310 nm
Wavelength channel 2
Package OUI
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Application Notes NVRAM Register Contents (cont'd) Address Dec Hex 32834 8042 32835 8043 32836 8044 32837 8045 32838 8046 32839 8047 32840 8048 32841 8049 32842 804A 32843 804B 32844 804C 32845 804D 32846 804E 32847 804F 32848 8050 32849 8051 32850 8052 32851 8053 32852 8054 32853 8055 32854 8056 32855 8057 32856 8058 32857 8059 32858 805A 32859 805B Vendor revision Vendor part number Group Basic XENPAK MSA 3.0 Definition Vendor name Value Dec Hex 32 20 70 79 32 71 109 98 72 86 50 51 56 51 51 45 71
1)
Comment
46 4F 20 47 6D 62 48 56 32 33 38 33 33 2D 47
1)
F O G m b H V 2 3 8 3 3 G
1)
48 48 53 65 48
2)
31 30 34 41 30
2)
1 0 4 A 0
2)
49 66 50
31 42 32
1 B 2
Preliminary Product Information
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Application Notes NVRAM Register Contents (cont'd) Address Group Dec Hex 32860 805C Basic 32861 805D 32862 805E 32863 805F 32864 8060 32865 8061 32866 8062 32867 8063 32868 8064 32869 8065 32870 8066 32871 8067 32872 8068 32873 8069 32874 806A 32875 806B 32876 806C 32877 806D 32878 806E 32879 806F 32880 8070 32881 8071 32882 8072 32883 8073 32884 8074 32885 8075 32886 8076 32887 8077 32888 8078 Month code Day code Lot code 5 V stressed environment reference 3.3 V stressed environment reference APS stressed environment reference 1 1 2 1 1 2 250 mA 500 mA 750 mA Year code XENPAK MSA 3.0 Definition Vendor serial number Value Dec Hex 80 50 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 Comment
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Application Notes NVRAM Register Contents (cont'd) Address Dec Hex 32889 8079 32890 807A 32891 807B 32892 807C 32893 807D 32894 to 32941 32942 to 33030
1)
Group Basic
XENPAK MSA 3.0 Definition Nominal APS voltage DOM capability Optional capability reserved Basic checksum Customer area
Value Dec Hex 20 14 195 0 0 C3 0 0
Comment +1.8 V not default none
807E to 80AD 80AE to 8106
Vendor specific
2)
V23833-G2104-A001: Dec = 50, Hex = 32, Comment = 2 V23833-G6104-A001: Dec = 54, Hex = 36, Comment = 6 V23833-G6104-A011: Dec = 54, Hex = 36, Comment = 6 V23833-G2104-A001: Dec = 48, Hex = 30, Comment = 0 V23833-G6104-A001: Dec = 48, Hex = 30, Comment = 0 V23833-G6104-A011: Dec = 49, Hex = 31, Comment = 1
Preliminary Product Information
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V23833-Gx104-A0x1
Application Notes PCB Cage Footprints
Dimensions in mm [inches]
File: 2203
Figure 5
Standard Mounting
Dimensions in mm [inches]
File: 2204
Figure 6
Belly-to-Belly Mounting
Preliminary Product Information
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Application Notes Host Board Layouts
41.91 [1.65] 35.51 [1.398]
PAD DETAIL SEE BELOW
29.6 14.8 13.8 13.4 1.550.05 10x 20.08 [.079.003] 0.15 [.006] G H J
65.66 [2.585]
62.36 [2.455]
55.88 [2.2]
47.8 [1.882]
44.07 [1.735]
31.75 [1.25]
19.05 [.75]
0.50.03 (70x)
35.51 [1.398] 40.23 [1.584]
38.1 [1.5]
4.24 [.167]
20.05 (70x)
6.60.38 [.26.015] 1) 2) 7.390.38 [.291.015] 3)
9.14 [.36] 1) 2)
H
J
3.94 [.155]
6.35 [.25]
12.7 [.5]
25.4 [1]
1) Tall profile 2) Low profile 3) Flangeless
0.8 (34x) PAD SPACING PAD DETAIL 41.91 [1.65] 1.02 [.04] 1) 2) 0.51 [.02] 3)
G
25.30.12 [.996.005] 1) 12.850.12 [.506.005] 2) 10.310.12 [.406.005] 3)
11.76 [.463] 1) 6.4 [.252] 2) 6.43 [.253] 3)
0.25 [.01] G H J
39.120.12 [1.54.005] 1) 2) 36.50.12 [1.437.005] 3)
Dimensions in mm [inches]
38.1 [1.5]
44.45 [1.75]
13.4 13.8
Figure 7
Host PCB, Board Connector Layout and Bezel Opening
Preliminary Product Information
23
2004-05-13
55.88 [2.2]
File: 2504
59.69 [2.35]
4.1
4.1
V23833-Gx104-A0x1
Application Notes
GND
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Toward Bezel 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35
GND GND GND RESERVED GND RESERVED 5.0 V GND 3.3 V TX LANE3- 3.3 V TX LANE3+ APS GND APS TX LANE2- LASI TX LANE2+ RESET GND VEND SPECIFIC TX LANE1- TX ON/OFF TX LANE1+ RESERVED GND MOD DETECT TX LANE0- VEND SPECIFIC TX LANE0+ VEND SPECIFIC GND MDIO GND MDC GND PRTAD4 RX LANE3- PRTAD3 RX LANE3+ PRTAD2 GND PRTAD1 RX LANE2- PRTAD0 RX LANE2+ VEND SPECIFIC GND APS SET RX LANE1- RESERVED RX LANE1+ APS SENSE GND APS RX LANE0- APS RX LANE0+ 3.3 V GND 3.3 V RESERVED 5.0 V RESERVED GND GND GND GND GND
70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36
Lower Row
Upper Row
File: 2505
Figure 8
Host Board Pad Layout
24 2004-05-13
Preliminary Product Information
V23833-Gx104-A0x1
Package Outlines Package Outlines
Dimensions in mm
File: 2202
Figure 9
XPAK with Bail De-Latch Mechanism
Preliminary Product Information
25
2004-05-13
V23833-Gx104-A0x1
Package Outlines
a)
a) For 0-80 UNF Screw assembly see Mechanical Characteristics
Dimensions in mm [inches]
File: 2212
Figure 10
XPAK with No De-Latch Mechanism
Preliminary Product Information
26
2004-05-13
V23833-Gx104-A0x1
Package Outlines
17.45 Laser class
Description 2.6 Part number 33.5 Country of origin Optional marking (MS/ES) Dimensions in mm YYYY: WW: nnnnnnnn: MMMMM: 8.5
year of production week of production serial number month of production
File: 2401
Figure 11
Label Description
Dimensions in mm
File: 2211
Figure 12
XPAK Temperature Reference Point
27 2004-05-13
Preliminary Product Information
V23833-G2104-A001, V23833-G6104-A001, V23833-G6104-A011 Revision History: Previous Version: Page 1 2 9 9 9 14 15 16 2004-05-13 2004-02-24 DS2
Subjects (major changes since last revision) V23833-G6104-A011 added Optical Features changed Electrical Features changed Environment: Thermal Management Recommendations changed Fibers and Connectors changed Cage Requirement changed Table "Electrical AC CharacteristicsCharacteristics" changed Table "Mechanical Characteristics" added Table "Laser Data" added Figure 3 Required Labels added Figure 4 Laser Emission added NVRAM Register Contents added Figure 10 XPAK with No De-Latch Mechanism added Figure 12 XPAK Temperature Reference Point changed
17 26 27
Edition 2004-05-13 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 Munchen, Germany
(c) Infineon Technologies AG 2004.
All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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